MB91F467DA datasheet(133/137 Pages) CYPRESS

133 / 137 page

Document Number: 002-04613 Rev. *A

Page 133 of 137

MB91460D Series

17. Package Dimension

208-pin plastic QFP

Lead pitch

0.50 mm

Pa ckage width

package length

28.0

× 28.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

3.95 mm MAX

We ight

5.71g

Remar k

Low heat resistance type

208-pin plastic QFP

(FPT -208P-M04)

(FPT-208P-M04)

2003-2008 FUJITSU MICROELECTRONICS LIMITED F208020S-c-3-5

.148 –.012

+.008

–0.30

+0.20

3.75

Details of "A" par t

0.50±0.20

(.020±.008)

0.60±0.15

(.024±.006)

0.25(.010)

(Stand off)

0.40

+0.10

–0.15

+.004

–.006

.016

0˚~8˚

LEAD No .

104

105

156

157

208

"A"

0.08(.003)

0.50(.020)

0.22±0.05

(.009±.002)

0.08(.003)

28.00±0.10(1.102±.004)SQ

30.60±0.20(1.205±.008)SQ

.007 –.003

+.001

–0.08

+0.03

0.17

INDEX

(Mounting height)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

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