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L5988D 데이터시트(PDF) 42 Page - STMicroelectronics

부품명 L5988D
상세설명  Pre-bias start up capability
PDF  52 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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L5988D 데이터시트(HTML) 42 Page - STMicroelectronics

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Application information
L5988D
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DocID15324 Rev 4
Figure 25) solves this matter placing the input filter just above the package of the device to
minimize noise. This placement offers the best filtering for the device and minimize the
noise injected by the pulsing current path. The additional stray inductance introduced in the
path from the switching node and the external inductor is not critical for the operation of the
device.
The pin 4 of the L5988D supplies most of the analog circuitry and MOSFET drivers so an
RMS current of few mA flows in its trace. A decoupling path between the power and signal
input reduces the issues induced by the switching noise: an RC network is helpful to filter
the signal supply from the noise generated by the switching activity and it becomes effective
when its time constant is bigger than two or three switching cycles. The pin 4 supplies the
drivers of the embedded MOSFET so the R value has to be kept limited to avoid voltage
spikes during the operation of the embedded driver (the maximum value is in the order of
few ohms).
The inductor current flows from power GND to the output capacitor during the conduction
time of the LS switch: the power ground plane and the signal ground are kept partitioned in
the PCB layout to minimize the injected noise on the signal ground. They are connected
together below the ground of the output capacitor which is the less noisy power component.
The connection of the external resistor divider to the feedback pin (FB) is an high
impedance node, so the interferences can be minimized placing the routing of feedback
node as far as possible from the high current paths. To reduce the pick up noise the resistor
divider has to be placed very close to the device.
Thanks to the exposed pad of the device, the ground plane helps to reduce the thermal
resistance junction to ambient; so a large ground plane enhances the thermal performance
of the converter allowing high power conversion.
Figure 24. Top board layout



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