GND PLANE

Represents via used for

application specific connections

IN

GND

OUT

NC

EN

NC

TLV702

SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015

www.ti.com

Layout Examples (continued)

Figure 29. Layout Example for the DSE Package

10.3 Thermal Consideration

Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the

device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again

enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection

circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a

result of overheating.

Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate

heatsink. For reliable operation, junction temperature should be limited to 125°C maximum.

To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature

until the thermal protection is triggered; use worst-case loads and signal conditions.

The internal protection circuitry of the TLV702 has been designed to protect against overload conditions. It was

not intended to replace proper heatsinking. Continuously running the TLV702 into thermal shutdown degrades

device reliability.

10.4 Package Mounting

Solder pad footprint recommendations for the TLV702 are available from the TI website at www.ti.com. The

recommended land pattern for the DBV and DSE packages are shown in Figure 28 and Figure 29, respectively.

16

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