GND PLANE

Represents via used for

application specific connections

IN

GND

EN

NC

OUT

P =(V

V

)

I

-

´

D

IN

OUT

OUT

TLV702

www.ti.com

SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015

9 Power Supply Recommendations

Connect a low output impedance power supply directly to the INPUT pin of the TLV702. Inductive impedances

between the input supply and the INPUT pin can create significant voltage excursions at the INPUT pin during

start-up or load transient events.

9.1 Power Dissipation

The ability to remove heat from the die is different for each package type, presenting different considerations in

the printed-circuit-board (PCB) layout. The PCB area around the device that is free of other components moves

the heat from the device to the ambient air.

Refer to Thermal Information for thermal performance on the TLV702 evaluation module (EVM). The EVM is a

two-layer board with two ounces of copper per side.

the output current and the voltage drop across the output pass element, as shown in Equation 2.

(2)

10 Layout

10.1 Layout Guidelines

Input and output capacitors should be placed as close to the device pins as possible. To improve AC

performance such as PSRR, output noise, and transient response, TI recommends designing the board with

addition, the ground connection for the output capacitor should be connected directly to the GND pin of the

device. High ESR capacitors may degrade PSRR performance.

10.2 Layout Examples

Figure 28. Layout Example for the DBV Package

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Product Folder Links: TLV702