ST7MC1K2 datasheet(314/371 Pages) STMICROELECTRONICS

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12.2.2

Current characteristics

12.2.3

Thermal characteristics

Table 187.

Current characteristics

Symbol

Ratings

Max. value

Unit

IVDD

Total current into VDD power lines (source)

(1)

32-pin devices

44-pin devices

125

IVSS

Total current out of VSS ground lines (sink)

(1)

32-pin devices

44-pin devices

125

IIO

Output current sunk by any standard I/O and control pin

Output current sunk by any high sink I/O pin

Output current source by any I/Os and control pin

- 25

IINJ(PIN)

(2)(3)

Injected current on VPP pin

± 5

Injected current on RESET pin

± 5

Injected current on OSC1 and OSC2 pins

± 5

Injected current on any other pin(4)

± 5

ΣI

INJ(PIN)

(2)

Total injected current (sum of all I/O and control pins)(4)

± 20

All power (VDD) and ground (VSS) lines must always be connected to the external supply.

IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum cannot be

respected, the injection current must be limited externally to the IINJ(PIN) value. A positive injection is induced by VIN>VDD

while a negative injection is induced by VIN<VSS.

Negative injection disturbs the analog performance of the device.

See Table 221: ADC accuracy with VDD = 5.0V on

page 350 and Note 1 on page 351.

For best reliability, it is recommended to avoid negative injection of more than 1.6mA

When several inputs are submitted to a current injection, the maximum

ΣI

INJ(PIN) is the absolute sum of the positive and

negative injected currents (instantaneous values). These results are based on characterization with

ΣI

INJ(PIN) maximum

current injection on four I/O port pins of the device.

Table 188.

Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

-65 to +150

°C

Maximum junction temperature (see Section 13.2.3: Thermal characteristics on page 355)

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