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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM8TL52X4 데이터시트(PDF) 77 Page - STMicroelectronics |
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STM8TL52X4 데이터시트(HTML) 77 Page - STMicroelectronics |
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77 / 84 page  DocID022344 Rev 7 77/84 STM8TL52x4 STM8TL53x4 Package information 79 Figure 38. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package footprint 1. Dimensions are expressed in millimeters. L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - k 0° - 8° 0° - 8° aaa - - 0.100 - - 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 3. Dimension “E1” does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side. Table 43. TSSOP20 – 20-lead thin shrink small outline, 6.5 x 4.4 mm, 0.65 mm pitch, package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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