NAND01GR3A datasheet(53/57 Pages) STMICROELECTRONICS

53 / 57 page

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NAND128-A, NAND256-A, NAND512-A, NAND01G-A

PART NUMBERING

Table 28. Ordering Information Scheme

Devices are shipped from the factory with the memory content bits, in valid blocks, erased to ’1’.

For further information on any aspect of this device, please contact your nearest ST Sales Office.

Example:

NAND512R3A

A ZA

Device Type

NAND = NAND Flash Memory

Density

128 = 128Mb

256 = 256Mb

512 = 512Mb

01G = 1Gb

Operating Voltage

R = VDD = 1.7 to 1.95V

W = VDD = 2.7 to 3.6V

Bus Width

3 = x8

4 = x16

Family Identifier

A = 528 Bytes/ 264 Word Page

Device Options

0 = No Options

2 = Chip Enable Don’t Care Enabled

Product Version

A = First Version

B = Second Version

C = Third Version

Package

N = TSOP48 12 x 20mm (all devices)

V = USOP48 12 x 17 x 0.65mm (128Mbit, 256Mbit and 512Mbit devices)

ZA = VFBGA55 8 x 10 x 1mm, 6x8 ball array, 0.8mm pitch (128Mbit and 256Mbit devices)

ZB = TFBGA55 8 x 10 x 1.2mm, 6x8 ball array, 0.8mm pitch (512Mbit Dual Die devices)

ZA = VFBGA63 9 x 11 x 1mm, 6x8 ball array, 0.8mm pitch (512Mbit devices)

ZB = TFBGA63 9 x 11 x 1.2mm, 6x8 ball array, 0.8mm pitch (1Gbit Dual Die devices)

Temperature Range

1 = 0 to 70 °C

6 = –40 to 85 °C

Option

blank = Standard Packing

T = Tape & Reel Packing

E = Lead Free Package, Standard Packing

F = Lead Free Package, Tape & Reel Packing

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