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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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LED171596ARSLR 데이터시트(PDF) 4 Page - Texas Instruments |
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LED171596ARSLR 데이터시트(HTML) 4 Page - Texas Instruments |
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4 / 153 page  4 LED171596A SNVSAY2 – OCTOBER 2017 www.ti.com Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Pin Functions (continued) PIN TYPE DESCRIPTION NO. NAME 22 LED16 Analog Constant-current output 23 LED17 Analog Constant-current output 24 LED18 Analog Constant-current output 25 LED19 Analog Constant-current output 26 LED20 Analog Constant-current output 27 LED21 Analog Constant-current output 28 LED22 Analog Constant-current output 29 LED23 Analog Constant-current output 30 GND Ground Ground for analog and digital circuitry 31 VDD Power 3.3-V supply for analog and digital circuitry 32 INT Output Interrupt pin. Open drain output. Pull up to VDDIO 33 MISO_ADDR Input / Output SPI master in, slave out, and I2C address select input 34 MOSI_SDA Input / Output SPI master out, slave in, and I2C data. When configured for I2C, pull up to VDDIO required. 35 VDDIO Power Reference and power supply for logic pins 36 HS3 Analog High-side PMOS switch output for LED group 3 37 HS2 Analog High-side PMOS switch output for LED group 2 38 VLED Power Input pin for high-side switches 39 HS1 Analog High-side PMOS switch output for LED group 1 40 HS0 Analog High-side PMOS switch output for LED group 0 41 IFSEL_LATCH Input IFSEL = 1 selects I2C-compatible interface and IFSEL = 0 selects SPI interface after EN pin set high. Optional latch input for brightness and current register buffers when in normal mode. 42 SS_PWM Input SPI slave select and global PWM input 43 EN Input Enable (internally pulled low) 44 SCLK_SCL Input SPI serial clock and I2C clock input. When configured for I2C, pull up to VDDIO required. 45 GND Ground Connect to Ground 46 GND Ground Connect to Ground 47 GND Ground Connect to Ground 48 GND Ground Connect to Ground Exposed Thermal Pad Must be connected to GND (pins 1, 2, 3, 30, 45, 46, 47 and 48), LGND (pin 17) and common ground plane. See the Figure 310. Must be soldered to achieve appropriate power dissipation and mechanical reliability. |
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