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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MMPF0100Z 데이터시트(PDF) 117 Page - NXP Semiconductors |
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MMPF0100Z 데이터시트(HTML) 117 Page - NXP Semiconductors |
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117 / 128 page  NXP Semiconductors 117 PF0100Z TYPICAL APPLICATIONS 7.2 PF0100Z layout guidelines 7.2.1 General board recommendations 1. It is recommended to use an eight layer board stack-up arranged as follows: • High current signal •GND • Signal •Power •Power • Signal •GND • High current signal 2. Allocate TOP and BOTTOM PCB Layers for POWER ROUTING (high current signals), copper-pour the unused area. 3. Use internal layers sandwiched between two GND planes for the SIGNAL routing. 7.2.2 Component placement It is desirable to keep all component related to the power stage as close to the PMIC as possible, specially decoupling input and output capacitors. 7.2.3 General routing requirements 1. Some recommended things to keep in mind for manufacturability: • Via in pads require a 4.5 mil minimum annular ring. Pad must be 9.0 mils larger than the hole • Maximum copper thickness for lines less than 5.0 mils wide is 0.6 oz copper • Minimum allowed spacing between line and hole pad is 3.5 mils • Minimum allowed spacing between line and line is 3.0 mils 2. Care must be taken with SWxFB pins traces. These signals are susceptible to noise and must be routed far away from power, clock, or high power signals, like the ones on the SWxIN, SWx, SWxLX, SWBSTIN, SWBST, and SWBSTLX pins. They could be also shielded. 3. Shield feedback traces of the regulators and keep them as short as possible (trace them on the bottom so the ground and power planes shield these traces). 4. Avoid coupling traces between important signal/low noise supplies (like REFCORE, VCORE, VCOREDIG) from any switching node (i.e. SW1ALX, SW1BLX, SW1CLX, SW2LX, SW3ALX, SW3BLX, SW4LX, and SWBSTLX). 5. Make sure all components related to a specific block are referenced to the corresponding ground. Miscellaneous 0.1 μF 1 10 V X5R 0402 CD402C104K8PAC Kemet VDDIO 1.0 μF 1 10 V X5R 0402 CC0402KRX5R6BB105 Yageo America VIN 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER PWRON 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER RESETBMCU 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER SDWN 100 k Ω 1 1/16 W 0402 RK73H1ETTP1003F KOA SPEER INTB Notes 82. NXP does not assume liability, endorse, or warrant components from external manufacturers referenced in circuit drawings or tables. While NXP offers component recommendations in this configuration, it is the customer’s responsibility to validate their application. Table 138. Bill of materials (82) (continued) Value Qty Description Part# Manufacturer Component/pin |
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