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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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CC3235MODASF 데이터시트(PDF) 6 Page - Texas Instruments |
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CC3235MODASF 데이터시트(HTML) 6 Page - Texas Instruments |
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6 / 100 page  6 CC3235MODAS, CC3235MODASF SWRS233 – OCTOBER 2019 www.ti.com Submit Documentation Feedback Product Folder Links: CC3235MODAS CC3235MODASF Table of Contents Copyright © 2019, Texas Instruments Incorporated Table of Contents 1 Module Overview ........................................ 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagrams ........................... 3 2 Revision History ......................................... 7 3 Device Comparison ..................................... 8 3.1 Related Products .................................... 10 4 Terminal Configuration and Functions ............ 11 4.1 CC3235MODAx Pin Diagram ....................... 11 4.2 Pin Attributes and Pin Multiplexing .................. 12 4.3 Signal Descriptions .................................. 29 4.4 Drive Strength and Reset States for Analog-Digital Multiplexed Pins ..................................... 34 4.5 Pad State After Application of Power to Chip, but Before Reset Release ............................... 34 4.6 Connections for Unused Pins ....................... 35 5 Specifications ........................................... 36 5.1 Absolute Maximum Ratings ......................... 36 5.2 ESD Ratings ........................................ 36 5.3 Recommended Operating Conditions ............... 36 5.4 Current Consumption (CC3235MODAS) ........... 37 5.5 Current Consumption (CC3235MODASF) .......... 39 5.6 TX Power Control for 2.4 GHz Band ................ 41 5.7 TX Power Control for 5 GHz ........................ 43 5.8 Brownout and Blackout Conditions ................. 43 5.9 Electrical Characteristics for GPIO Pins ............ 45 5.10 GPIO Pins Except 25, 26, 42, and 44 (25°C) ....... 45 5.11 GPIO Pins 25, 26, 42, and 44 (25°C) ............... 46 5.12 Pin Internal Pullup and Pulldown (25°C) ............ 46 5.13 CC3235MODAx Antenna Characteristics ........... 47 5.14 WLAN Receiver Characteristics .................... 48 5.15 WLAN Transmitter Characteristics .................. 49 5.16 BLE and WLAN Coexistence Requirements ........ 50 5.17 Reset Requirement ................................. 50 5.18 Thermal Resistance Characteristics for MOB and MON Packages ..................................... 50 5.19 Timing and Switching Characteristics ............... 51 6 Detailed Description ................................... 63 6.1 Overview ............................................ 63 6.2 Functional Block Diagram ........................... 63 6.3 Arm® Cortex®-M4 Processor Core Subsystem ..... 64 6.4 Wi-Fi® Network Processor Subsystem .............. 65 6.5 Security .............................................. 67 6.6 FIPS 140-2 Level 1 Certification .................... 70 6.7 Power-Management Subsystem .................... 70 6.8 Low-Power Operating Mode ........................ 70 6.9 Memory .............................................. 72 6.10 Restoring Factory Default Configuration ............ 74 6.11 Boot Modes .......................................... 74 6.12 Hostless Mode ...................................... 75 6.13 Device Certification and Qualification ............... 76 6.14 SRRC Certification and Statement .................. 76 6.15 Module Markings .................................... 77 6.16 End Product Labeling ............................... 78 6.17 Manual Information to the End User ................ 78 7 Applications, Implementation, and Layout ....... 78 7.1 Typical Application .................................. 78 7.2 Device Connection and Layout Fundamentals ...... 81 7.3 PCB Layout Guidelines ............................. 81 8 Environmental Requirements and SMT Specifications ........................................... 83 8.1 PCB Bending ........................................ 83 8.2 Handling Environment .............................. 83 8.3 Storage Condition ................................... 83 8.4 PCB Assembly Guide ............................... 83 8.5 Baking Conditions ................................... 84 8.6 Soldering and Reflow Condition .................... 85 9 Device and Documentation Support ............... 86 9.1 Third-Party Products Disclaimer .................... 86 9.2 Development Tools and Software ................... 86 9.3 Firmware Updates ................................... 88 9.4 Device Nomenclature ............................... 88 9.5 Documentation Support ............................. 89 9.6 Related Links ........................................ 91 9.7 Support Resources .................................. 91 9.8 Trademarks .......................................... 91 9.9 Electrostatic Discharge Caution ..................... 91 9.10 Export Control Notice ............................... 91 9.11 Glossary ............................................. 91 10 Mechanical, Packaging, and Orderable Information .............................................. 92 10.1 Mechanical, Land, and Solder Paste Drawings ..... 92 10.2 Package Option Addendum ......................... 92 |
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