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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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CC3235MODASF 데이터시트(PDF) 91 Page - Texas Instruments |
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CC3235MODASF 데이터시트(HTML) 91 Page - Texas Instruments |
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91 / 100 page  91 CC3235MODAS, CC3235MODASF www.ti.com SWRS233 – OCTOBER 2019 Submit Documentation Feedback Product Folder Links: CC3235MODAS CC3235MODASF Device and Documentation Support Copyright © 2019, Texas Instruments Incorporated 9.6 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now. Table 9-1. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY CC3235MODAS Click here Click here Click here Click here Click here CC3235MODASF Click here Click here Click here Click here Click here 9.7 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 9.8 Trademarks SimpleLink, Texas Instruments, E2E, BoosterPack, Sitara are trademarks of Texas Instruments. Arm, Cortex, Thumb are registered trademarks of Arm Limited. Bluetooth is a registered trademark of Bluetooth SIG Inc. IOS is a registered trademark of Cisco. Android is a trademark of Google LLC. Macrocell is a trademark of Kappa Global Inc. Macronix is a trademark of Macronix International Co.. WPA, WPA2, Wi-Fi CERTIFIED are trademarks of Wi-Fi Alliance. Wi-Fi, Wi-Fi Direct, Wi-Fi Alliance are registered trademarks of Wi-Fi Alliance. All other trademarks are the property of their respective owners. 9.9 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 9.10 Export Control Notice Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws. 9.11 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. |
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