Data Sheet

ADRF5132

Rev. B | Page 9 of 12

APPLICATIONS INFORMATION

EVALUATION BOARD

The ADRF5132-EVALZ can handle high power levels and

temperatures at which the device operates.

The ADRF5132-EVALZ evaluation board is constructed with

eight metal layers and dielectrics between each layer as shown

in Figure 13. Each metal layer has 1 oz (1.3 mil) copper

thickness, whereas the external layers are 1.5 oz copper.

The top dielectric material is 10 mil Rogers RO4350, which

exhibits a very low thermal coefficient, offering control over the

thermal rise of the board. The dielectrics between the other

metal layers are FR4. The total board thickness achieved is

60 mil.

W = 18mil

G = 13mil

T = 2.1 mil

H = 10mil

1.5oz Cu (2.1mil)

RO4350 = 10mil

FR4

FR4

FR4

FR4

FR4

FR4

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1.5oz Cu (2.1mil)

1.5oz Cu (2.1mil)

1.5oz Cu (2.1mil)

Figure 13. ADRF5132-EVALZ Evaluation Board Cross Sectional View

The top copper layer has all RF and dc traces, whereas the other

seven layers provide sufficient ground and help to handle the

thermal rise on the ADRF5132-EVALZ. In addition, via holes

are provided around transmission lines and under the exposed

pad of package, as shown in Figure 15, for proper thermal

grounding. RF transmission lines on the evaluation board are

coplanar wave guide design with a width of 18 mil and ground

spacing of 13 mil.

To ensure maximum heat dissipation and reduce thermal rise

on the evaluation board, some application considerations are

essential. Attach the ADRF5132-EVALZ to a copper support

plate at the bottom of the evaluation board. The ADRF5132-

EVALZ comes with this support plate attachment. Attach the

ADRF5132-EVALZ with its support plate to a big heat sink

using thermal grease during all high power operations. Figure 14

shows the evaluation board temperature vs. RF power input

tested with the preceding conditions and precautions

(evaluation board and support plate attached to a big heat sink).

The temperature rise is less than 5°C up to 43 dBm RF power

input, which provides the required thermal dissipation when

operated at high power levels.

81

80

79

78

77

76

75

38.0 38.5 39.0 39.5 40.0 40.5 41.0 41.5 42.0 42.5 43.0

RF POWER INPUT (dBm)

Figure 14. ADRF5132-EVALZ Evaluation Board Temperature Rise

(Oven Temperature Set to 75°C)

Figure 15. ADRF5132-EVALZ Evaluation Board Layout