ATXP032 datasheet(2/113 Pages) DIALOG

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DS-ATXP032–114I–4-2020

DATASHEET

ATXP032

EcoXiP™ High Performance

Low-Power Octal Flash

Features

Optimized for eXecute-in-Place (XiP) operations

Instant on

Reduces average latency for improving CPU

performance

Enables 40% higher CPU performance than the basic

octal SPI protocol

High throughput

Octal xSPI mode (8-8-8) with dual data rate (DDR)

150 MHz maximum operating frequency in octal DDR

mode

Up to 300 MBytes per second data rate in octal DDR

mode

Full JESD251, and JESD216D compatibility

Supports SPI modes 0 and 3

Low power dissipation

60 nA ultra-deep power-down current (typical)

4 µA deep power-down current (typical)

20 µA standby current (typical, for SPI Mode)

35 µA standby current (typical, for octal mode)

10 mA active read current (typical @ 66 MHz for SPI

Mode @ 1 pF load)

34 mA active read current (typical, @ 133 MHz, for octal

mode dual data rate @ 1 pF load)

Single voltage operation with range of 1.7V to 1.95V

Flexible, optimized erase architecture for code + data

storage applications

Uniform 4-Kbyte block erase

Uniform 32-Kbyte block erase

Uniform 64-Kbyte block erase

Full chip erase

Hardware controlled locking of protected sectors via WP pin

256-byte, One-Time Programmable (OTP) security register

128 bytes factory programmed with unique identifier

128 bytes user programmable

Flexible programming

Byte/page program (1 to 256 bytes)

Single and octal-input byte/page program (1 to 256

bytes)

Write-to-buffer and write-buffer-to-memory

commands

Active status interrupt when program or erase

operation has finished

Program and erase suspend/resume

Power optimized program and erase control

Automatic deep power-down or ultra-deep power-

down upon the completion of program or erase

operation

Automatic checking and reporting of program/erase

failures

Software controlled reset

Hardware reset pin

JEDEC standard (JESD252) hardware reset

JEDEC standard (JEP106AX) manufacturer and device ID

read methodology

Support for Serial Flash Discoverable Parameters (SFDP)

Programmable I/O drive strength

Endurance: 100,000 program/erase cycles

Data Retention: 20 years

Complies with full industrial temperature range

-40°C - 85°C for packaged parts

-40°C - 105°C for Die Wafer Form (DWF)

Industry standard green (Pb/halide-free/RoHS compliant)

package options

24-ball BGA

29-ball WLCSP

Die Wafer Form (DWF)

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