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MCP79522-I/MS 데이터시트(PDF) 49 Page - Microchip Technology |
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MCP79522-I/MS 데이터시트(HTML) 49 Page - Microchip Technology |
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49 / 58 page ![]() 2012-2022 Microchip Technology Inc. and its subsidiaries DS20002300D-page 49 MCP7951X/MCP7952X Microchip Technology Drawing C04-021-MS Rev E Sheet 2 of 2 10-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: REF: Reference Dimension, usually without tolerance, for information purposes only. 3. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 1. Notes: 2. Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Dimensioning and tolerancing per ASME Y14.5M. protrusions shall not exceed 0.15mm per side. L1 Footprint Mold Draft Angle Lead Width Lead Thickness c b Dimension Limits Overall Height Molded Package Thickness Molded Package Width Overall Length Foot Length Standoff Overall Width Number of Pins Pitch A L E1 D A1 E A2 e N Units 0.95 REF - - 0.08 0.15 0.23 0.33 MILLIMETERS 0.50 BSC 0.85 3.00 BSC 3.00 BSC 0.60 4.90 BSC 0.40 0.00 0.75 MIN NOM 1.10 0.80 0.15 0.95 MAX 10 - -- 8° 0° - C SEATING PLANE L (L1) c DETAIL A Foot Angle - 15° 5° 1 4X 1 4X 1 |
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