GSIB660 datasheet(5/70 Pages) TOSHIBA

5 / 70 page

1. Some semiconductor (“solid state”) devices

are easily damaged by static electricity. Such

components are called Electrostatically

Sensitive Devices (ESDs); examples include

integrated circuits and some field-effect

transistors. The following techniques will

reduce the occurrence of component damage

caused by static electricity.

2. Immediately before handling any semicon

ductor components or assemblies, drain the

electrostatic charge from your body by

touching a known earth ground. Alternatively,

wear a discharging wrist-strap device. (Be

sure to remove it prior to applying power—

this is an electric shock precaution.)

3. After removing an ESD-equipped assembly,

place it on a conductive surface such as

aluminum foil to prevent accumulation of

electrostatic charge.

4. Do not use freon-propelled chemicals. These

can generate electrical charges that damage

ESDs.

5. Use only a grounded-tip soldering iron when

soldering or unsoldering ESDs.

6. Use only an anti-static solder removal device.

Many solder removal devices are not rated as

“anti-static”; these can accumulate sufficient

electrical charge to damage ESDs.

7. Do not remove a replacement ESD from its

protective package until you are ready to

install it. Most replacement ESDs are

packaged with leads that are electrically

shorted together by conductive foam,

aluminum foil or other conductive materials.

8. Immediately before removing the protective

material from the leads of a replacement ESD,

touch the protective material to the chassis or

circuit assembly into which the device will be

installed.

9. Minimize body motions when handling

unpackaged replacement ESDs. Motions such

as brushing clothes together, or lifting a foot

from a carpeted floor can generate enough

static electricity to damage an ESD.

Precautions

1-4

1-3 Precautions for Electrostatically Sensitive Devices (ESDs)

GSIB660 데이터시트(PDF) 5 Page - Toshiba Semiconductor

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