GRM0332C2A6R9DA01 datasheet(77/89 Pages) MURATA1

77 / 89 page

C02E.pdf

Nov.27,2017

Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

278

Caution

2. Check the cropping method for the printed circuit board

in advance.

2-1. Printed circuit board cropping shall be carried out by

using a jig or an apparatus (Disc separator, router

type separator, etc.) to prevent the mechanical

stress that can occur to the board.

Level of stress on board

Board Separation Method

High

Hand Separation

Nipper Separation

Medium

(1) Board Separation Jig

Medium

(2) Disc Separator

Low

Recommended

Notes

Hand and nipper

separation apply a high

level of stress.

Use another method.

· Board handling

· Board bending direction

· Layout of capacitors

· Board handling

· Layout of slits

· Design of V groove

· Arrangement of blades

· Controlling blade life

Board handling

(3) Router Type Separator

Board Separation Apparatus

* When a board separation jig or disc separator is used, if the following precautions are not observed, a large board deﬂection stress will occur and the capacitors

may crack. Use router type separator if at all possible.

(1) Example of a suitable jig

[In the case of Single-side Mounting]

An outline of the board separation jig is shown as

follows. Recommended example: Stress on the

component mounting position can be minimized by

holding the portion close to the jig, and bend in the

direction towards the side where the capacitors

are mounted. Not recommended example: The risk

of cracks occurring in the capacitors increases due

to large stress being applied to the component

mounting position, if the portion away from the jig

is held and bent in the direction opposite the side

where the capacitors are mounted.

[Outline of Jig]

Load Point

Board Cropping Jig

V-groove

Printed Circuit Board

Components

Printed Circuit Board

Direction of Load

Printed Circuit Board

Not Recommended

Recommended

[In the case of Double-sided Mounting]

Since components are mounted on both sides of the

board, the risk of cracks occurring can not be

avoided with the above method.

Therefore, implement the following measures to

prevent stress from being applied to the

components.

(Measures)

(1) Consider introducing a router type separator.

If it is dicult to introduce a router type separator,

implement the following measures. (Refer to item 1.

Mounting Position)

(2) Mount the components parallel to the board

separation surface.

(3) When mounting components near the board

separation point, add slits in the separation position

near the component.

(4) Keep the mounting position of the components

away from the board separation point.

Hand Separation

Continued from the preceding page.

Continued on the following page.

GRM0332C2A6R9DA01 데이터시트(PDF) 77 Page - Murata Manufacturing Co., Ltd

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