| 전자부품 데이터시트 검색엔진 |
|
GRM0332C2A6R9DA01 데이터시트(PDF) 88 Page - Murata Manufacturing Co., Ltd |
|
|
|||||||||||||||||||||||||||||
GRM0332C2A6R9DA01 데이터시트(HTML) 88 Page - Murata Manufacturing Co., Ltd |
|
88 / 89 page ![]() C02E.pdf Nov.27,2017 ! Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 289 Notice Continued from the preceding page. [Sizes: 1205(3212M) / 1206(3216M) / 1806(4516M)] Bonding agent Coating position of bonding agent The flux in the solder paste contains halogen-based substances and organic acids as activators. Strong acidic flux can corrode the capacitor and degrade its performance. Please check the quality aer mounting, please use. 6. Reflow Soldering o Set temperature and time to ensure that leaching of the terminations does not exceed 25% of the chip end area as a single chip (full length of the edge A-B-C-D shown at right) and 25% of the length A-B shown as mounted on substrate. [As a Single Chip] [As Mounted on Substrate] 5. Flow Soldering A B C D Termination (Outer Electrode) A B 4. Flux for Flow Soldering 1. An excessive amount of flux generates a large quantity of flux gas, which can cause a deterioration of solderability, so apply flux thinly and evenly throughout. (A foaming system is generally used for flow soldering.) 2. Flux containing too high a percentage of halide may cause corrosion of the terminations unless there is sucient cleaning. Use flux with a halide content of 0.1% max. 3. Strong acidic flux can corrode the capacitor and degrade its performance. Please check the quality of capacitor aer mounting. 3. Adhesive Curing 1. Insucient curing of the adhesive can cause chips to disconnect during flow soldering and causes deterioration in the insulation resistance between the terminations due to moisture absorption. Control curing temperature and time in order to prevent insucient hardening. Continued on the following page. (2) Use the following illustration as a guide to the amount of adhesive to apply. Cross Sectional View Side View Resist Adhesive Land Board <Applicable to NFM Series> [Sizes: 0603(1608M) / 0805(2012M) / 1206(3216M)] |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |