ZAMC4100GA2R datasheet(75/156 Pages) RENESAS

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ZAMC4100 Datasheet

January 26, 2016

Table 3.9, and Table 3.1).

To cover all possible failure scenarios, the ZAMC4100 features different resources for detecting short failures on

the module level and on the IC level. Failures on the IC level are detected using internal diagnostic current

sources and over-current protection, while detecting failures on the module level also requires the dedicated ADC

channel for direct measuring of the EC_M pin voltage (see Table 3.36). Because the EC_M pin is used for

sensing the potential at the mirror terminal, it gives precise information for the overall status and current operating

condition of the ECM functionality. Any failure on the IC or module level will result in an unexpected or inaccurate

response at the EC_M potential with respect to the configuration in the ECMCTRL register (see section 3.11.2).

The ADC ECM voltage channel together with the “open/short diagnostic check” (see 3.11.3) provides all the

necessary information for the MCU firmware to distinguish between different types of ECM short failures.

3.11.2. ECM Control Register

Table 3.27 ECMCTRL Register Bits Mapping

Name

ECMCTRL

Bit No

Bit name

Reset

Access

R/W

Address

0x09

R/W = Read/Write bit

Table 3.28 ECMCTRL Register Bits Description

Bit

Description

ECMEN:

1) 2) 3) Electrochromatic mirror driver enable bit.

1 = ECM driver is enabled.

0 = ECM driver is disabled.

DSCEN:

1) 2) Electrochromatic mirror discharge enable bit.

1 = ECM driver low-side MOSFET is ON; EC mirror discharge enabled.

0 = ECM driver low-side MOSFET is OFF; EC mirror discharge disabled.

5:0

ECMDAC[5:0]:

1) 2) Electrochromatic control DAC bits.

111111 = ECM driver provides maximum output voltage (see Table 1.9).

000000 = ECM driver provides minimum output voltage (see Table 1.9).

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