PC7447AMGH1000LB datasheet(11/44 Pages) ATMEL

11 / 44 page

5387B–HIREL–07/05

PC7447A [Preliminary]

Notes:

1. Caution: The input threshold selection must agree with the OVDD voltages supplied. See notes

in Table 6-1 on page 9.

2. If used, pull-down resistors should be less than 250

Ω.

6.4

Thermal Characteristics

6.4.1

Package Characteristics

Notes:

1. See ”Thermal Management Information” on page 12 for details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-

ture, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.

3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

4. Per JEDEC JESD51-6 with the board horizontal.

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

6. This is the thermal resistance between the die and the case top surface as measured with the cold plate method (MIL

SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of RθJC for the part is less than 0.1°C/W.

6.4.2

Internal Package Conduction Resistance

For the exposed-die packaging technology described in Table 6-4 on page 11, the intrinsic con-

duction thermal resistance paths are as follows:

• The die junction-to-case thermal resistance (the case is actually the top of the exposed

silicon die)

• The die junction-to-ball thermal resistance

Figure 19 depicts the primary heat transfer path for a package with an attached heat sink

mounted to a printed-circuit board.

Table 6-3.

Input Threshold Voltage Setting(1)

BVSEL Signal

Processor Bus Input Threshold is

Relative to:

Notes

01.8V

(2)

¬HRESET

Not available

HRESET

2.5V

12.5V

Table 6-4.

Package Thermal Characteristics(1)

Symbol

Characteristic

Value

Unit

RθJA

(2)(3)

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board

°C/W

RθJMA

(2)(4)

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board

°C/W

RθJMA

(2)(4)

Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer (1s) board

°C/W

RθJMA

(2)(4)

Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer (2s2p) board

°C/W

RθJB

(5)

Junction-to-board thermal resistance

°C/W

RθJC

(6)

Junction-to-case thermal resistance

< 0.1

°C/W

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