PC7447AMGH1000LB datasheet(14/44 Pages) ATMEL

부품명	PC7447AMGH1000LB

상세설명	PowerPC RISC microprocessor

PDF	44 Pages

Scroll/Zoom	100%

제조업체	ATMEL [ATMEL Corporation]

홈페이지	http://www.atmel.com

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14 / 44 page

5387B–HIREL–07/05

PC7447A [Preliminary]

Figure 6-4.

Thermal Performance of Select Thermal Interface Material

6.4.4.1

Heat Sink Selection Example

For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:

j = TI + Tr + (R

θJC + Rθint + Rθsa) × Pd

where:

j is the die-junction temperature

i is the inlet cabinet ambient temperature

r is the air temperature rise within the computer cabinet

RθJC is the junction-to-case thermal resistance

Rθint is the adhesive or interface material thermal resistance

Rθsa is the heat sink base-to-ambient thermal resistance

d is the power dissipated by the device

0.5

1.5

010

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

PC7447AMGH1000LB 데이터시트(PDF) 14 Page - ATMEL Corporation