PC7447AMGH1000LB datasheet(42/44 Pages) ATMEL

42 / 44 page

5387B–HIREL–07/05

PC7447A [Preliminary]

14. Package Mechanical Data

The following sections provide the package parameters and mechanical dimensions for the

HITCE package.

14.1 Package Parameters for the PC7447A, 360 HITCE

The package parameters are as provided in the following list. The package type is 25 × 25 mm,

360-lead high coefficient of the thermal expansion ceramic ball grid array (HITCE).

Package outline

25 mm × 25 mm

Interconnects

360 (19 × 19 ball array - 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.72 mm

Maximum module height

3.24 mm

Ball diameter

0.89 mm (35 mil)

15. Ordering Information

Note:

1. For availability of the different versions, contact your local Atmel sales office.

16. Definitions

16.1 Life Support Applications

These products are not designed for use in life support appliances, devices or systems where

malfunction of these products can reasonably be expected to result in personal injury. Atmel

customers using or selling these products for use in such applications do so at their own risk and

agree to fully indemnify Atmel for any damages resulting from such improper use or sale.

7447A

1000

Prefix

Type

Revision Level(1)

Rev. B

Application modifier(1)

L: 1.3V ± 50 mV

N: 1.1V ± 50 mV

Max internal processor speed(1)

1000 MHz (N-Spec)

1167 MHz (N-Spec) TBC

1333 MHz (L-Spec)

1420 MHz (L-Spec) TBC

Temperature Range: Tj(1)

Prototype

(X)

V: -40˚C, 110˚C

M: -55˚C +125˚C

Package

GH: HITCE

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