MPM3834C – 6V, 3A, ULTRA-SMALL STEP-DOWN POWER MODULE

MPM3834C Rev. 1.01

MonolithicPower.com

3

6/14/2022

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© 2022 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1

SW

SW test pin. Float the SW pin.

2, 7, 8

PGND

Power ground.

3

EN

On/off control.

4

AGND

Analog ground for the internal control circuit. The AGND pin is not connected to PGND

internally. Connect AGND to the PGND on the PCB layout.

5

FB

Feedback. Use an external resistor divider from the output to AGND, tapped to the FB pin,

to set the output voltage (VOUT).

6

OUT_S Output voltage sense.

9, 10

OUT

Power output.

11

PG

Power good indicator. The output of the PG pin is an open drain with an internal pull-up

resistor connected to the IN pin. PG is pulled up to IN when the FB voltage is within 10% of

the regulation level; otherwise, PG is low.

12, 13,

14

IN

Power input.

ABSOLUTE MAXIMUM RATINGS (1)

VSW......................................................................

-0.3V (-5V for <10ns) to +6.5V (+10V for <10ns)

All other pins ................................-0.3V to +6.5V

Continuous power dissipation (TA = 25°C) (5)

ECLGA-14 (2.5mmx2.5mm) ...................... 2.2W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ...................... 2000V

Charged device model (CDM) ................. 2000V

Recommended Operating Conditions (2)

Operation input voltage range ......... 2.75V to 6V

Operating junction temp (TJ). ... -40°C to +125°C

Thermal Resistance (3) (4) (5) (6) (7)

ECLGA-14 (2.5mmx2.5mm)

θJA ...................................................... 56.7°C/W

θJC_TOP ................................................ 6.85°C/W

θJB ...................................................... 25.5°C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The device is not guaranteed to function outside of its

operating conditions.

3)

θ

JA is the junction-to-ambient thermal resistance, θJC_TOP is the

junction-to-case top thermal characterization parameter, and

θ

JB

is

the

junction-to-board

thermal

characterization

parameter.

4) The thermal parameter is based on the test on the MPS

evaluation board (T-EVM3834C-PA-00A) under a no airflow

cooling condition in a standard enclosure. The board size is

5.1cmx5.1cm, 2 layers, of which top and bottom layer copper

thickness is 2oz.

5) The maximum allowable power dissipation is a function of the

maximum junction temperature, TJ (MAX), the junction-to-

ambient

thermal

resistance,

θ

JA,

and

the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation produces an excessive die

temperature.

6) The junction-to-case top thermal characterization parameter,

θ

JC_TOP, estimates the junction temperature in the real system,

based on equation TI = θJC_TOP x PLOSS + TCASE_TOP. Where

PLOSS is the entire loss of the module in real applications, and

TCASE_TOP is case top temperature

7) The junction-to-board thermal characterization parameter,

θ

JB,

estimation the junction temperature in the real system, based

on equation TI = θJB x PLOSS +TBOARD. Where PLOSS is the entire

power loss of the module in real applications, and TBOARD is

board temperature.