IMX7SCEC datasheet(21/155 Pages) NXP

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Electrical characteristics

i.MX 7Solo Family of Applications Processors Datasheet, Rev. 7, 09/2023

NXP Semiconductors

4.1.2

Thermal resistance

4.1.2.1

FPBGA case “X” and case “Y” package thermal resistance

Table 8 displays the thermal resistance data.

Per JEDEC JESD51-2, the intent of thermal resistance measurements is solely for a thermal performance

comparison of one package to another in a standardized environment. This methodology is not meant to

and does not predict the performance of a package in an application-specific environment.

4.1.3

Operating ranges

Table 9 provides the operating ranges of the i.MX 7Solo family of processors. For details on the chip's

power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 7Solo Application

Processor Reference Manual (IMX7SRM).

1 OVDD is the I/O supply voltage.

Table 8. Thermal Resistance Data

Rating

Test conditions

Symbol

12x12

pkg value

19x19

pkg value Unit

Junction to Ambient1

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Single-layer board (1s); natural convection2

Four-layer board (2s2p); natural convection2

2 Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified

package.

RJA

55.4

32.6

44.4

30.2

oC/W

Junction to Ambient1

Single-layer board (1s); airflow 200 ft/min2,3

Four-layer board (2s2p); airflow 200 ft/min2,3

3 Per JEDEC JESD51-6 with the board horizontal.

RJA

41.8

28.0

34.3

25.8

oC/W

Junction to Board1,4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—

RJB

16.0

17.4

oC/W

Junction to Case1,5

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

—

RJC

10.5

10.4

oC/W

Junction to Package Top1,6

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Natural Convection

JT

0.2

oC/W

Junction to Package Bottom

Natural Convection

RB_CSB

15.3

17.3

oC/W

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