EMC2101-R-ACZL-TR datasheet(43/56 Pages) MICROCHIP

43 / 56 page

 2022 Microchip Technology Inc. and its subsidiaries

DS20006703A-page 43

EMC2101

SEATING

PLANE

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Molded Package Width

Molded Package Thickness

Pitch

Standoff

Units

Dimension Limits

0.65 BSC

0.85

0.40

0.22

–

0.00

–

0.60

–

MILLIMETERS

MIN

NOM

0.80

0.40

1.10

0.15

MAX

0.95 REF

Footprint

Overall Length

3.00 BSC

Terminal Thickness

0.08–0.23

–

0.07

–

Lead Bend Radius

–

0.07

–

Lead Bend Radius

–

0°

8°

Foot Angle

–

5°

15°

Mold Draft Angle

0.75

0.95

4.90 BSC

3.00 BSC

DETAIL B

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Sheet 2 of 2

4X 1

(L1)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

protrusions shall not exceed 0.15mm per side.

8-Lead Plastic Micro Small Outline Package (UA) - 3x3 mm Body [MSOP]

Microchip Technology Drawing C04-111-UA Rev D

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