| 전자부품 데이터시트 검색엔진 |
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RT3612EB 데이터시트(PDF) 3 Page - Richtek Technology Corporation |
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RT3612EB 데이터시트(HTML) 3 Page - Richtek Technology Corporation |
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3 / 47 page ![]() RT3612EB 3 DS3612EB-02 December 2019 www.richtek.com © Copyright 2019 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. Pin No. Pin Name Pin Function 12 VREF06 Voltage source output. During controller internal setting period, it outputs 3.2V. In normal operation, it outputs 0.6V to offset IMON signal. While controller shuts down or in PS4, voltage source shuts down. An exact 0.47 F capacitor and 3.9 resistor from this pin to GND are required for stability. 13 RGND Return ground. This pin is the negative input of output voltage differential remote sense. 14 VSEN Voltage sense input. This pin is connected to the terminal of controller output voltage. 15 COMP Error amplifier output pin. 16 FB Negative input of the error amplifier. This pin is for output voltage feedback to controller. 20, 17 ISEN[1:2]P Positive current sense inputs of channel 1 and 2. 19, 18 ISEN[1:2]N Negative current sense inputs of channel 1 and 2. 21 TSEN Thermal sense input and function settings for advanced ramp magnitude in PS1, advanced ramp magnitude in PS0, zero loadline enable and DVID voltage compensation. 22 VIN Input voltage pin. Connect an RC filter whose time constant need less than switch period for sensing input voltage. 23 VRON Controller enable pin. A logic high signal enables the controller. 24 VR_READY VR ready indicator. 26, 32 UGATE[1:2] High-side driver output. Connect the pin to the gate of high-side MOSFET. 27, 31 PHASE[1:2] Switch node of high-side driver. Connect the pin to high-side MOSFET source together with the low-side MOSFET drain and inductor. 28, 30 LGATE[1:2] Low-side driver output. This pin drives the gate of low-side MOSFET. 29 PVCC Driver power supply input. Connect this pin to 5V and place a minimum 2.2 F ceramic capacitor. 33 (Exposed Pad) GND Ground. The exposed pad must be soldered to a large PCB and connected to GND for maximum power dissipation. |
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