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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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FS32K118LAT0MLHT 데이터시트(PDF) 69 Page - NXP Semiconductors |
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FS32K118LAT0MLHT 데이터시트(HTML) 69 Page - NXP Semiconductors |
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69 / 84 page  J12 J10 J11 Input data valid Output data valid TCLK TDI/TMS TDO J14 TDO J13 Figure 34. Test Access Port timing Thermal attributes 7.1 Description The tables in the following sections describe the thermal characteristics of the device. NOTE Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting side (board) temperature, ambient temperature, air flow, power dissipation or other components on the board, and board thermal resistance. 7.2 Thermal characteristics 7 Thermal attributes S32K1xx Data Sheet, Rev. 9, 09/2018 NXP Semiconductors 69 |
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