LAN9252SLASHML datasheet(308/329 Pages) MICROCHIP

308 / 329 page

LAN9252

DS00001909A-page 308

 2015 Microchip Technology Inc.

18.3

Package Thermal Specifications

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.

TABLE 18-1:

64-PIN QFN PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Units

Comments

Thermal Resistance Junction to Ambient

JA

23.6

°C/W

Measured in still air

Thermal Resistance Junction to Bottom of Case

JT

0.1

°C/W

Measured in still air

Thermal Resistance Junction to Top of Case

JC

1.8

°C/W

Airflow 1 m/s

TABLE 18-2:

64-PIN TQFP-EP PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Units

Comments

Thermal Resistance Junction to Ambient

JA

29.0

°C/W

Measured in still air

Thermal Resistance Junction to Bottom of Case

JT

0.3

°C/W

Measured in still air

Thermal Resistance Junction to Top of Case

JC

12.8

°C/W

Airflow 1 m/s

TABLE 18-3:

MAXIMUM POWER DISSIPATION

Mode

Maximum Power (mW)

Internal Regulator Disabled, 2.5 V Ethernet Magnetics

568

Internal Regulator Disabled, 3.3 V Ethernet Magnetics

640

Internal Regulator Enabled, 2.5 V Ethernet Magnetics

749

Internal Regulator Enabled, 3.3 V Ethernet Magnetics

821

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