ADC08B200

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SNAS388F – MARCH 2007 – REVISED APRIL 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

Supply Voltage (VA, VP, VD, VDR)

-0.3V to 3.8V

Driver Supply Voltage (VDR)

-0.3V to VA +0.3V

Voltage on Any Input or Output Pin

−0.3V to VA

Reference Voltage (VRT, VRB)

GND to VA

Input Current, Data Outputs

±1 mA

Input Current all other pins (4)

±25 mA

Package Input Current (4)

±50 mA

Power Dissipation at TA = 25°C

See (5)

ESD Susceptibility (6)

Human Body Model

2500V

Machine Model

200V

Charged Device Model

1000V

Soldering Temperature, Infrared, 10 seconds

235°C

Storage Temperature

−65°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For specifications and test conditions, see the Electrical

Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the

device is not operated under the listed test conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.

(4)

When the input voltage at any pin exceeds the power supplies (that is, less than GND or DR GND, or greater than VA, VP, VD or VDR),

the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can

safely exceed the power supplies with an input current of 25 mA to two.

(5)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula

PDMAX = (TJmax − TA) / θJA.

(6)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through ZERO

Ohms.

OPERATING RATINGS

(1) (2)

Operating Temperature Range

−40°C ≤ TA ≤ +105°C

Supply Voltage (VA)

+3.0V to +3.6V

Driver Supply Voltage (VDR)

+2.7V to (VA + 0.3V)

Maximum Supply Voltage

VD, VP

VA + 0.3V

CLK Frequency

PLL Bypassed

1 to 210 MHz

PLL used

15 to 105 MHz

RCLK Frequency (3)

2 - 210 MHz

RCLK Duty Cycle

35% to 65%

Ground Difference |GND - DR GND|

0V to 300 mV

Upper Reference Voltage (VRT)

0.5V to (VA − 0.3V)

Lower Reference Voltage (VRB)

0V to (VRT − 0.5V)

Reference Delta (VRT − VRB)

0.5V to 2.3V

VIN Voltage Range

VRB to VRT

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For specifications and test conditions, see the Electrical

Characteristics. The specifications apply only for the test conditions listed. Some performance characteristics may degrade when the

device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = DR GND = 0V, unless otherwise specified.

(3)

RCLK should be stopped with the buffer is not being read.

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