PESDXV4UF_G_W_3

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 03 — 28 January 2008

13 of 16

NXP Semiconductors

PESDxV4UF/G/W

Very low capacitance quadruple ESD protection diode arrays

Reflow soldering is the only recommended soldering method.

Fig 16. Reflow soldering footprint PESDxV4UW (SOT665)

2.45

2.10

0.30

0.15

(2x)

0.375

(2

×)

0.45

(2

×)

0.70

(2

×)

0.40

(5

×)

0.55

1.60

1.20

2.20

1.25

1.375

2.00 1.70 1.00

solder lands

solder resist

placement area

occupied area

0.075

Dimensions in mm