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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32H533CE 데이터시트(PDF) 211 Page - STMicroelectronics |
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STM32H533CE 데이터시트(HTML) 211 Page - STMicroelectronics |
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211 / 231 page  DS14539 Rev 1 211/231 STM32H533xx Package information 227 6.5 UFQFPN48 package information (A0B9) This UFQFPN is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 67. UFQFPN48 – Outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN48 package. It is recommended to connect and solder this back-side pad to PCB ground. D1 E1 EXPOSED PAD E2 e D2 PIN 1 idenfier BOTTOM VIEW L A A3 C FRONT VIEW DETAIL A SEATING PLANE LEADS COPLANARITY C ddd SEATING PLANE A1 A1 A C C ddd PIN 1 IDENTIFIER LASER MAKER AREA E D TOP VIEW A0B9_UFQFPN48_ME_V4 |
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