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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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STM32H533CE 데이터시트(PDF) 225 Page - STMicroelectronics |
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STM32H533CE 데이터시트(HTML) 225 Page - STMicroelectronics |
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225 / 231 page  DS14539 Rev 1 225/231 STM32H533xx Package information 227 integral heat slug. A distinguish feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. 9. e represents the solder ball grid pitch. 10. N represents the total number of balls on the BGA. 11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the position of the centre ball(s) in the outer row or column of a fully populated matrix. 12. Values in inches are converted from mm and rounded to 4 decimal digits. 13. Drawing is not to scale. Figure 76. UFBGA144 - Footprint example Table 129. UFBGA144 - Example of PCB design rules (0.80 mm pitch BGA) Dimension Values Pitch 0.80 mm Dpad 0.400 mm Dsm 0.550 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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