AD4884BBCZ datasheet(12/116 Pages) AD

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Data Sheet

AD4884

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 12 of 116

Table 3. Absolute Maximum Ratings

Parameter

Rating

Analog Inputs

SJ+ChA to SJ−ChA, SJ+ChB to SJ−ChB

±1V

IN3+ChA to IN3−ChA, IN3+ChB to IN3−ChB

±2V

IN2+ChA to IN2−ChA, IN2+ChB to IN2−ChB

±4V

IN1+ChA to IN1−ChA, IN1+ChB to IN1−ChB

±7V

VOCM_ChX to GND

−VS to +VS + 0.3V

OUT+ChX, OUT−ChX1 to GND

−0.3V to +3.6V

Supply Voltage

+VS to −VS

11V

REFIN, VDD33 to GND

−0.3V to +3.6V

VDDLDO to GND

−0.3V to +2.75V

VDD11ChX to GND

−0.3V to +1.26V

IOVDDChX to GND

−0.3V to +1.26V

Digital Inputs and Outputs

Inputs (CNV±ChX, CLK±ChX) to GND

−0.3V to +2.75V

LVDS OUTPUT (DCO±ChX, DA±ChX, DB±ChX) to GND

−0.3V to +1.26V

CSChX, SCLKChX , SDIChX to GND

−0.3V to +2.75V

GPIOnChX to GND

−0.3V to +1.26V

DISABLE_FDAChXA to GND

−VS − 0.3V to +VS

+ 0.3V

SDOAChX, SDOBChX, SDOCChX, SDODChX to GND

−0.3V to 1.26V

Temperature

Storage Range

−55°C to +150°C

Operating Range

−40°C to +85°C

Maximum TJ

105°C

Maximum Reflow (Package) as per JEDEC J-STD-020

260°C

1 The FDA output pins OUT+ChX and OUT−ChX have the consideration of analog

inputs since they drive the inputs of the ADC. The voltage into these nodes

is indirectly driven by the user via the FDA, which means that respecting this

Absolute Maximum Rating involves limiting the differential input voltage to the

FDA, taking into account the configured FDA gain.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure. θJC is the junction-

to-case thermal resistance. θJB is the junction-to-board thermal

resistance. ΨJT is the junction-to-top thermal characterization.

Thermal resistance values specified in Table 4 are simulated based

on JEDEC specs (unless specified otherwise) and must be used in

compliance with JESD51-12.

Table 4. Thermal Resistance1

Package Type

θJA

θJC

θJB

ΨJT

Unit

BC-196-20

37.3

3.6

°C/W

1 Thermal resistance values are based on simulation of a 2S2P JEDEC PCB

with vias, except for θJC, which is based on a 1S0P JEDEC PCB simulation.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD-protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged-device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for the AD4884

Table 5. AD4884, 196-Ball CSP_BGA

ESD Model

Withstand Threshold (V)

Class

HBM

±1000

FICDM

±500

C2a

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged

devices and circuit boards can discharge without detection.

Although this product features patented or proprietary protec-

tion circuitry, damage may occur on devices subjected to high

energy ESD. Therefore, proper ESD precautions should be

taken to avoid performance degradation or loss of functionality.

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