GD32H757ZMT7 datasheet(88/151 Pages) GIGADEVICE

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GD32H757xx Datasheet

Figure 4-2. Recommended power supply decoupling capacitors(1)(2)(3)

100 nF

VBAT

VSS

N * VDD

VSS

4.7

μF + N * 100 nF

10 nF

VDDA

VSSA

μF

10 nF

VREFP

VREFN

μF

VSS

VCORE

2x2.2

μF or 2x100nF

(1)

The VREFP and VREFN pins are only available on no less than 100-pin packages, or else the VREFP and

VREFN pins are not available and internally connected to VDDA and VSSA pins.

(2)

All decoupling capacitors need to be as close as possible to the pins on the PCB board.

(3)

When voltage regulator is enabled the two 2.2 μF Vcore capacitors are required , if bypassing the voltage

regulator ,two 100 nF decoupling capacitors are required.

Table 4-4. Vcore operating conditions(1)(2)(3)

Symbol

Parameter

Conditions

CEXT

Capacitance of external capacitor

2.2 μF

ESR

ESR of external capacitor

< 100 mΩ

(1)

When bypassing the voltage regulator, the two 2.2 μF V

CORE capacitors are not required and should be replaced

by two 100 nF decoupling capacitors.

(2)

This value corresponds to CEXT typical value. A variation of +/-20% is tolerated.

(3)

If a third VCORE pin is available on the package, it must be connected to the other VCORE pins but no additional

capacitor is required.

Table 4-5. Clock frequency(1)(2)

Symbol

Parameter

Conditions

Min

Max

Unit

fCPU

core clock frequency

Supply voltage < 3.6V

—

600

MHz

Supply voltage < 2.3V

—

400

fAHB

AHB clock frequency

Supply voltage < 3.6V

—

300

Supply voltage < 2.3V

—

200

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