B72580E1140S262 datasheet(69/81 Pages) EPCOS

69 / 81 page

CTVS - Ceramic transient voltage suppressors

SMD multilayer varistors (MLVs), automotive E series

PPD ML PD

2021-01-08

Please read Cautions and warnings and

Page 69 of 81

Important notes at the end of this document.

Recommended soldering temperature profiles

2.1

Reflow soldering temperature profile

Temperature ranges for reflow soldering acc. to IEC 60068-2-58 recommendations.

Profile feature

Sn-Pb eutectic assembly

Pb-free assembly

- Preheat and soak

- Temperature min

- Temperature max

- Time

Tsmin

Tsmax

Tsmin to tsmax

+100 °C

+150 °C

60 ... 120 s

+150 °C

+200 °C

60 ... 120 s

Average ramp-up rate

Tsmax to Tp

3 °C/ s max.

Liquidous temperature

Time at liquidous

+183 °C

40 ... 150 s

+217 °C

40 ... 150 s

Peak package body temperature

+215 °C ... +260 °C1)

+235 °C ... +260 °C

Time above (Tp

-5 °C)

10 ... 40 s

Average ramp-down rate

Tp to Tsmax

6 °C/ s max.

Time +25 °C to peak temperature

max. 8 minutes

Notes:

All temperatures refer to topside of the package, measured on the package body

surface.

Number of reflow cycles: 3.

Iron soldering should be avoided, hot air methods are recommended for repair

purposes.

Depending on package thickness.

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