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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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B72580E1140S262 데이터시트(PDF) 70 Page - EPCOS |
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B72580E1140S262 데이터시트(HTML) 70 Page - EPCOS |
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70 / 81 page  CTVS - Ceramic transient voltage suppressors SMD multilayer varistors (MLVs), automotive E series PPD ML PD 2021-01-08 Please read Cautions and warnings and Page 70 of 81 Important notes at the end of this document. 3 Solder joint profiles / solder quantity 3.1 Nickel barrier termination If the meniscus height is too low, that means the solder quantity is too low, the solder joint may break, i.e. the component becomes detached from the joint. This problem is sometimes interpreted as leaching of the external terminations. If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur. As the solder cools down, the solder contracts in the direction of the component. If there is too much solder on the component, it has no leeway to evade the stress and may break, as in a vise. The figures below show good and poor solder joints for dual-wave and infrared soldering. 3.1.1 Solder joint profiles for nickel barrier termination Good and poor solder joints caused by amount of solder in reflow soldering. |
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