MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 0

Package Information

Freescale Semiconductor

42

5

Package Information

6

Product Documentation

•

MSC8113 Technical Data Sheet (MSC8113). Details the signals, AC/DC characteristics, clock signal characteristics,

package and pinout, and electrical design considerations of the MSC8113 device.

•

MSC8113 Reference Manual (MSC8113RM). Includes functional descriptions of the extended cores and all the

internal subsystems including configuration and programming information.

•

Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8113 device.

•

SC140 DSP Core Reference Manual. Covers the SC3400 core architecture, control registers, clock registers, program

control, and instruction set.

Figure 34. MSC8113 Mechanical Information, 431-pin FC-PBGA Package

Notes:

1. All dimensions in millimeters.

2. Dimensioning and tolerancing

per ASME Y14.5M–1994.

3. Features are symmetrical about

the package center lines unless

dimensioned otherwise.

4. Maximum solder ball diameter

measured parallel to Datum A.

5. Datum A, the seating plane, is

determined by the spherical

crowns of the solder balls.

6. Parallelism measurement shall

exclude any effect of mark on

top surface of package.

7. Capacitors may not be present

on all devices.

8. Caution must be taken not to

short capacitors or exposed

metal capacitor pads on

package top.

9. FC CBGA (Ceramic) package

code: 5238.

FC PBGA (Plastic) package

code: 5263.

10.Pin 1 indicator can be in the

form of number 1 marking or an

“L” shape marking.