AD9961-EBZ datasheet(58/60 Pages) AD

58 / 60 page

AD9961/AD9963

Rev. 0 | Page 58 of 60

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4

0.20 REF

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

0.50

0.40

0.30

8.50 REF

7.10

BSC SQ

EXPOSEDPAD

(BOTTOM VIEW)

TOP VIEW

9.75

BSC SQ

10.00

BSC SQ

PIN 1

INDICATOR

SEATING

PLANE

12° MAX

0.60

0.42

0.24

0.60

0.42

0.24

0.30

0.23

0.18

0.50

BSC

PIN 1

INDICATOR

COPLANARITY

0.08

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 104. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

10 mm × 10 mm Body, Very Thin Quad

(CP-72-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD9961BCPZ

−40°C to +85°C

72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-72-4

AD9961BCPZRL

−40°C to +85°C

72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-72-4

AD9963BCPZ

−40°C to +85°C

72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-72-4

AD9963BCPZRL

−40°C to +85°C

72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-72-4

AD9961-EBZ

−40°C to +85°C

Evaluation Board

AD9963-EBZ

−40°C to +85°C

Evaluation Board

HSC-DAC-EVALCZ

−40°C to +85°C

Pattern Generation and Capture Card

1 Z = RoHS Compliant Part.

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