AD9961-EBZ datasheet(8/60 Pages) AD

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AD9961/AD9963

Rev. 0 | Page 8 of 60

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

With

Respect to

Rating

RX33V, AUX33V

RXGND

−0.3 V to +3.9 V

TXVDD

TXGND

−0.3 V to +3.9 V

DRVDD

DGND

−0.3 V to +3.9 V

CLK33V

EPAD

−0.3 V to +3.9 V

RX18V, RX18VF

RXGND

−0.3 to +2.1 V

DVDD18V

EPAD

−0.3 to +2.1 V

CLK18V, DLL18V

EPAD

−0.3 to +2.1 V

RXGND, TXGND, DGND,

EPAD

−0.3 V to +0.3 V

TXIP, TXIN, TXQP, TXQN

TXGND

−1.0 V to TXVDD +

0.3 V

RXIP, RXIN, RXQP, RXQN

RXGND

−0.3 V to RX18V +

0.3 V

CS, SCLK, SDIO,

DGND

RESET,

LDO_EN

−0.3V to DRVDD +

0.3 V

TRXD[11:0], TXD[11:0], TXIQ,

TRXIQ, TXCLK, TRXCLK

DGND

−0.3 V to DRVDD +

0.3 V

CLKP, CLKN

EPAD

−0.3 V to CLK33V +

0.3 V

Junction Temperature

+125°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the

customer board increases the reliability of the solder joints,

maximizing the thermal capability of the package.

Table 7. Thermal Resistance

Airflow

Unit

1 m/sec

17.1

10.6

1.0

°C/W

0 m/sec

20.3

°C/W

Typical θJA, θJB, and θJC are specified for a JEDEC standard 51-7

High-κ thermal test board. Airflow increases heat dissipation,

effectively reducing θJA. In addition, metal in direct contact with

the package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

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