PA162

PA162U

3

P r o d u c t I n n o v a t i o n F r o m

Parameter

Min

Typ

Max

Units

POWERSUPPLY

5

30

40

V

CURRENT, quiescent +Vs (A/B)

8

10

mA

CURRENT, quiescent +Vs (C/D)

8

10

mA

CURRENT, quiescent total

16

20

mA

THERMAL

RESISTANCE, junction to case

DC, 1 amplifier

7.16

7.87

°C/W

4.69

5.16

°C/W

3.08

3.39

°C/W

2.51

2.77

°C/W

AC, 1 amplifier

5.37

5.90

°C/W

3.52

3.87

°C/W

2.31

2.54

°C/W

1.89

2.07

°C/W

25

°C/W

NOTES:

1. (All Min/Max characteristics and specifications are guaranteed over the Specified Operating Condi-

tions. Typical performance characteristics and specifications are derived from measurements taken

at typical supply voltages and T

2. Long term operation at the maximum junction temperature will result in reduced product life. Derate

power dissipation to achieve high MTTF.

3. Unless otherwise noted, the following conditions apply: ±V

4. +V

5. Rating applies when power dissipation is equal in each of the amplifiers. Power and thermal ratings

are based on two separate dual monolithic power op-amps on one integrated copper heatslug.

Amplifiers A and B are combined on one monolithic die while amplifiers C and D are on the other.

6. If -V

age.

7. Rating applies when the heatslug of the DK package is soldered to a minimum of 1 square inch foil

area of a printed circuit board.

20-pinPSOP

PACKAGESTYLEDK

NC

-IN(A)

+IN(A)

+IN(B)

-IN(B)

-IN(C)

+IN(C)

+IN(D)

-IN(D)

NC

-VS

OUT(A)

+VS(A/B)

OUT(B)

-VS

-VS

OUT(C)

+VS(C/D)

OUT(D)

-VS

A

1

10

20

11

B

-

+

+

-

C

D

FIGURE2.EXTERNALCONNECTIONS.