MPC8306EC datasheet(50/76 Pages) FREESCALE

부품명	MPC8306EC

상세설명	PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications

PDF	76 Pages

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제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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50 / 76 page

MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0

Freescale Semiconductor

Package and Pin Listings

21 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8306 is available in

a thermally enhanced MAPBGA (mold array process-ball grid array); see Section 21.1, “Package

Parameters for the MPC8306,” and Section 21.2, “Mechanical Dimensions of the MPC8306 MAPBGA,”

for information on the MAPBGA.

21.1

Package Parameters for the MPC8306

The package parameters are as provided in the following list.

Package outline

19 mm

19 mm

Package Type

MAPBGA

Interconnects

369

Pitch

0.80 mm

Module height (typical)

1.48 mm; Min = 1.31mm and Max 1.61mm

Solder Balls

96 Sn / 3.5 Ag / 0.5 Cu (VM package)

Ball diameter (typical)

0.40 mm

21.2

Mechanical Dimensions of the MPC8306 MAPBGA

Figure below shows the mechanical dimensions and bottom surface nomenclature of the

MPC8306, 369-MAPBGA package.

MPC8306EC 데이터시트(PDF) 50 Page - Freescale Semiconductor, Inc