전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

ADP1046ACPZ-R7 데이터시트(PDF) 10 Page - Analog Devices

부품명 ADP1046ACPZ-R7
상세설명  Digital Controller for Isolated
PDF  96 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
Logo AD - Analog Devices

ADP1046ACPZ-R7 데이터시트(HTML) 10 Page - Analog Devices

Back Button ADP1046ACPZ-R7 Datasheet HTML 6Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 7Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 8Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 9Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 10Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 11Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 12Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 13Page - Analog Devices ADP1046ACPZ-R7 Datasheet HTML 14Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 10 / 96 page
background image
ADP1046
Data Sheet
Rev. 0 | Page 10 of 96
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (Continuous), VDD
4.2 V
Digital Pins: OUTA, OUTB, OUTC, OUTD,
OUTAUX, SR1, SR2, GATE, PGOOD1,
PGOOD2
−0.3 V to VDD + 0.3 V
VS3− to PGND, AGND, DGND
−0.3 V to +0.3 V
VS1, VS2, VS3+
−0.3 V to VDD + 0.3 V
RTD, ADD
−0.3 V to VDD + 0.3 V
CS1, CS2+, CS2−
−0.3 V to VDD + 0.3 V
FLAGIN, PSON
−0.3 V to VDD + 0.3 V
SDA, SCL
−0.3 V to VDD + 0.3 V
SHAREo, SHAREi
−0.3 V to VDD + 0.3 V
Operating Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
240°C
RoHS-Compliant Assemblies
(20 sec to 40 sec)
260°C
ESD Charged Device Model
1.5 kV
ESD Human Body Model
3.5 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
32-Lead LFCSP
44.4
6.4
°C/W
SOLDERING
It is important to follow the correct guidelines when laying out
the PCB footprint for the ADP1046 and when soldering the
part onto the PCB. For detailed information about these guide-
lines, see the AN-772 Application Note.
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com