PIC16F883-ESLASHSO. datasheet(257/338 Pages) MICROCHIP

257 / 338 page

 2006-2012 Microchip Technology Inc.

DS41291G-page 257

PIC16F882/883/884/886/887

17.6

Thermal Considerations

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40°C

 TA  +125°C

Param

No.

Sym.

Characteristic

Typ.

Units

Conditions

TH01

JA

Thermal Resistance

Junction to Ambient

47.2

C/W

40-pin PDIP package

24.4

C/W

44-pin QFN package

45.8

C/W

44-pin TQFP package

60.2

C/W

28-pin PDIP package

80.2

C/W

28-pin SOIC package

89.4

C/W

28-pin SSOP package

C/W

28-pin QFN package

TH02

JC

Thermal Resistance

Junction to Case

24.7

C/W

40-pin PDIP package

20.0

C/W

44-pin QFN package

14.5

C/W

44-pin TQFP package

C/W

28-pin PDIP package

23.8

C/W

28-pin SOIC package

23.9

C/W

28-pin SSOP package

20.0

C/W

28-pin QFN package

TH03

Junction Temperature

150

For derated power calculations

TH04

Power Dissipation

—

PD = PINTERNAL + PI/O

TH05

PINTERNAL Internal Power Dissipation

—

PINTERNAL = IDD x VDD

(NOTE 1)

TH06

PI/O

I/O Power Dissipation

—

PI/O =

 (IOL * VOL) +  (IOH * (VDD -

VOH))

TH07

PDER

Derated Power

—

PDER = (TJ - TA)/

JA

(NOTE 2, 3)

Note 1: IDD is current to run the chip alone without driving any load on the output pins.

2: TA = Ambient Temperature.

3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power

dissipation or derated power (PDER).

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