M68ICS08GR datasheet(387/408 Pages) FREESCALE

387 / 408 page

MC68HC908GR8 — Rev 4.0

Technical Data

MOTOROLA

Mechanical Specifications

387

Technical Data — MC68HC908GR8

Section 24. Mechanical Specifications

24.1 Contents

24.2

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 387

24.3

32-Pin LQFP (Case #873A) . . . . . . . . . . . . . . . . . . . . . . . . . .388

24.4

28-Pin PDIP (Case #710) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 389

24.5

28-Pin SOIC (Case #751F). . . . . . . . . . . . . . . . . . . . . . . . . . . 390

24.2 Introduction

The MC68HC908GR8 is available in these packages:

•

32-pin low-profile quad flat pack (LQFP)

•

28-pin dual in-line package (PDIP)

•

28-pin small outline package (SOIC)

The package information contained in this section is the latest available

at the time of this publication. To make sure that you have the latest

package specifications, contact one of the following:

•

Local Motorola Sales Office

•

World Wide Web at http://www.motorola.com/semiconductors/

Follow World Wide Web on-line instructions to retrieve the current

mechanical specifications.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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