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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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W25X05CLZPIG 데이터시트(PDF) 35 Page - Winbond |
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W25X05CLZPIG 데이터시트(HTML) 35 Page - Winbond |
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35 / 51 page  W25X05CL/10CL/20CL Publication Release Date: March 23, 2012 - 35 - Revision B 8.2.24 JEDEC ID (9Fh) For compatibility reasons, the W25X05CL/10CL/20CL provide several instructions to electronically determine the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure 25. For memory type and capacity values refer to Manufacturer and Device Identification table. Figure 25. Read JEDEC ID |
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