AN4544 datasheet(16/35 Pages) STMICROELECTRONICS

16 / 35 page

Datasheet explanation

AN4544

16/35

DocID026535 Rev 1

Rth(JC): thermal resistance from the device junction to the device case. It is the thermal

resistance when the package is mounted on the infinite heatsink

Rth(CH): the contact thermal resistance between the device case and the heatsink

Rth(HA): thermal resistance from the heatsink to ambient

Figure 12. Thermal resistance scheme

The thermal resistance stated in datasheet refers to the above mentioned RTH(J-C) and to

the overall RTH(J-A).

Equation 6

2.4.9

Maximum transient thermal impedance (ZthJC)

Transient thermal impedance takes into account the heat capacity of the device to estimate

temperatures resulting from power loss on transient base.

Table 7. Absolute maximum ratings for J-C and J-A thermal resistances

Symbol

Parameter

Value

Unit

RthJC

Thermal resistance junction-case IGBT

0.53

°C/W

RthJC

Thermal resistance junction-case diode

1.14

°C/W

RthJA

Thermal resistance junction-ambient

°C/W

th j

–

()

th j

–

()

th c

–

()

th h

–

()

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