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UPD75402ACT 데이터시트(PDF) 42 Page - NEC

부품명 UPD75402ACT
상세설명  4 BIT SINGLE-CHIP MICROCOMPUTER
PDF  48 Pages
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제조업체  NEC [NEC]
홈페이지  http://www.nec.com/
Logo NEC - NEC

UPD75402ACT 데이터시트(HTML) 42 Page - NEC

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µPD75402A(A)
12. RECOMMENDED SOLDERING CONDITIONS
The following conditions shall be met when soldering the
µPD75402A(A).
For details of the recommended soldering conditions, refer to our document "SMD Surface Mount
Technology Manual" (IEI-1207).
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
under different conditions.
Table 12-1 Soldering Conditions for Surface-Mount Devices
µPD75402AGB(A)-×××-3B4: 44-pin plastic QFP (10 × 10 mm)
Caution Do not apply more than a single process at once, except for “Partial heating method.”
Table 12-2 Soldering Conditions for Insertion-Mount Devices
µPD75402AC(A)-×××: 28-pin plastic DIP (600 mil)
µPD75402ACT(A)-×××: 28-pin plastic shrink DIP (400 mil)
Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does
not come in contact with the main body of the package.
Solder temperature: 260 ˚C or less
Flow time: 10 seconds or less
Terminal temperature: 260 ˚C or less
Flow time: 10 seconds or less
Wave soldering
(Only for leads)
Partial heating method
Soldering process
Soldering conditions
Peak package’s surface temperature: 230 ˚C
Reflow time: 30 seconds or less (210 ˚C or more)
Number of reflow processes: 1
Peak package’s surface temperature: 215 ˚C
Reflow time: 40 seconds or less (200 ˚C or more)
Number of reflow processes: 1
Solder temperature: 260 ˚C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature: 120 ˚C max. (measured on the package
surface)
Terminal temperature: 300 ˚C or less
Flow time: 3 seconds or less (for each side of device)
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Symbol
IR30-00-1
VP15-00-1
WS60-00-1
—
Soldering conditions
Notice
Other versions of the products are available. For these versions, the recommended reflow
soldering conditions have been mitigated as follows:
Higher peak temperature (235
°C), two-stage, and longer exposure limit.
Contact an NEC representative for details.



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