| 전자부품 데이터시트 검색엔진 |
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LTC1736 데이터시트(PDF) 26 Page - Linear Technology |
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LTC1736 데이터시트(HTML) 26 Page - Linear Technology |
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26 / 28 page ![]() 26 LTC1736 APPLICATIO S I FOR ATIO Figure 10. LTC1736 Layout Diagram 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 COSC RUN/SS ITH FCB SGND PGOOD SENSE – SENSE + VFB VOSENSE VID0 VID1 TG BOOST SW VIN INTVCC BG PGND EXTVCC VIDVCC VID4 VID3 VID2 LTC1736 1000pF 47pF CC1 COSC CC2 CSS RC + 4.7 µF L1 EXTERNAL EXTVCC CONNECTION DB CIN – – + + CB D1 M1 M2 RSENSE COUT VIN VOUT 1736 F10 SENSE + SENSE – HIGH CURRENT PATH 1736 F11 CURRENT SENSE RESISTOR (RSENSE) Figure 11. Kelvin Sensing RSENSE 2. Does the VOSENSE pin connect as close as possible to the load? The optional 50pF to 100pF capacitor from VFB to SGND should be as close as possible to the LTC1736. 3. Are the SENSE – and SENSE + leads routed together with minimum PC trace spacing? The filter capacitor be- tween SENSE + and SENSE – should be as close as possible to the LTC1736. Ensure accurate current sens- ing with kelvin connections as shown in Figure 11. Series resistance can be added to the SENSE lines to increase noise rejection. 4. Does the (+) terminal of CIN connect to the drain of the topside MOSFET(s) as closely as possible? This capaci- tor provides the AC current to the MOSFET(s). 5. Is the INTVCC decoupling capacitor connected closely between INTVCC and the power ground pin? This ca- pacitor carries the MOSFET driver peak currents. An additional 1 µF ceramic capacitor placed immediately next to the INTVCC and PGND pins can help improve noise performance. 6. Keep the switching node (SW), Top Gate node (TG) and Boost node (BOOST) away from sensitive small-signal nodes, especially from the voltage and current sensing feedback pins. All of these nodes have very large and fast moving signals and therefore should be kept on the “output side” (Pins 13 to 24) of the LTC1736 and occupy minimum PC trace area. |
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