UCS1002-1 datasheet(15/116 Pages) MICROCHIP

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Programmable USB Port Power Controller with Charger Emulation

Datasheet

SMSC UCS1002

Revision 1.4 (07-16-13)

DATASHEET

Chapter 3 Electrical Specifications

Note: Stresses above those listed could cause permanent damage to the UCS1002. This is a stress

rating only and functional operation of the UCS1002 at any other condition above those

indicated in the operation sections of this specification is not implied.

Note 3.1

A High K board uses a thermal via design with the thermal landing soldered to the PCB

ground plane with 0.3 mm (12 mil) diameter vias in a 3x3 matrix (9 total) at 0.5 mm (20 mil)

pitch. The board is multi-layer with 1-ounce internal power and ground planes and 2-ounce

copper traces on top and bottom. A Low K board is a two layer board without thermal via

design with 2-ounce copper traces on the top and bottom.

Table 3.1 Absolute Maximum Ratings

Voltage on VDD, VS, and VBUS pins

-0.3 to 6

Pullup voltage (VPULLUP)

-0.3 to VDD + 0.3

Data switch current (IHSW_ON), switch on

±50

Port power switch current

Internally limited

Data switch pin voltage to ground (DPOUT, DPIN, DMOUT,

DMIN); (VDD powered or unpowered)

-0.3 to VDD + 0.3

Differential voltage across open data switch (DPOUT - DPIN,

DMOUT - DMIN, DPIN - DPOUT, DMIN - DMOUT)

VDD

Voltage on any other pin to ground

-0.3 to VDD + 0.3

Current on any other pin

±10

Package power dissipation

See Table 3.2

Operating ambient temperature range

-40 to 125

°C

Storage temperature range

-55 to 150

°C

Table 3.2 Power Dissipation Summary

BOARD

PKG

θJC

θJA

DERATING

FACTOR

ABOVE 25 °C

TA <

25 °C

POWER

RATING

TA =

70 °C

POWER

RATING

TA =

85 °C

POWER

RATING

High K

(see Note 3.1)

20-pin QFN

4 mm x 4 mm

6°C /

41 °C /

24.4 mW / °C

2193 mW

1095 mW

729 mW

Low K

(see Note 3.1)

20-pin QFN

4 mm x 4 mm

6°C /

60 °C /

16.67 mW /

°C

1498 mW

748 mW

498 mW

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