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STM32F411RET6 데이터시트(PDF) 138 Page - STMicroelectronics |
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STM32F411RET6 데이터시트(HTML) 138 Page - STMicroelectronics |
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138 / 149 page ![]() Package information STM32F411xC STM32F411xE 138/149 DocID026289 Rev 6 Figure 59. Recommended PCB design rules for pads (0.5 mm-pitch BGA) 1. Non solder mask defined (NSMD) pads are recommended. 2. 4 to 6 mils solder paste screen printing process. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 84. UFBGA100, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. |
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