ISO8200BQ datasheet(24/37 Pages) STMICROELECTRONICS

24 / 37 page

Power section

ISO8200BQ

24/37

DocID027303 Rev 4

7.2

Thermal protection

The device is protected against overheating in case of overload conditions. During the

driving period, if the output is overloaded, the device suffers two different thermal stresses,

the former related to the junction, and the latter related to the case.

The two faults have different trigger thresholds: the junction protection threshold is higher

than the case protection one; generally the first protection, that is active in thermal stress

conditions, is the junction thermal shutdown. The output is turned off when the temperature

is higher than the related threshold and turned back on when it goes below the reset

threshold. This behavior continues until the fault on the output is present.

If the thermal protection is active and the temperature of the package increases over the

fixed case protection threshold, the case protection is activated and the output is switched

off and back on when the junction temperature of each channel in fault and case

temperature is below the respective reset thresholds.

Figure 17: "Thermal protection flowchart" shows the thermal protection behavior, while

Figure 18: "Thermal protection" reports typical temperature trends and output vs. input

state.

Figure 17: Thermal protection flowchart

ISO8200BQ 데이터시트(PDF) 24 Page - STMicroelectronics